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50,000 Stock items for Same Day Ship Out.
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A wide variety of standard and configurable components for factory automation engineers in industries such as automotive, semiconductor, packaging, medical and many more.
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- Notice of End of Sales for Economy Series Pneumatic Equipment Category. More information.
Free Mount Cylinder Clean / Low Dust Generation 10-/11-/20-/21-/22-CDU Series (Part Numbers)
[10-/11-Series, Clean Series]
・ It is suitable for clean environment.
・ It prevents dust generation in the cleanroom.
[20-Series Copper/Fluorine-Free Specifications]
・ Suitable for use in environments that dislike copper and fluorine materials.
・ External dimensions are the same as standard products.
[21/22-Series, copper / fluorine / silicone-free + low dust generation]
・ It supports environments with restrictions on copper-based, fluorine-based, and silicone-based materials.
・ The structure is the same as the Clean Series (Grease and packaging are different from the Clean Series. )
(i)Caution
- ■ For selection / technical information and characteristics on SMC air cylinder products,
check here.
■ Handling SMC Products
Web pages for products currently without individual pages on this site will be released on an ad-hoc basis.
Click here for a quotation or to make an order if you have a model number. - Refer to the manufacturer's catalog for specification and material details.
- Product images may be representative images. Refer to the manufacturer's catalog for shape details.
Japanese Only
| Part Number | Standard Unit Price | Minimum order quantity | Volume Discount | Days to Ship | Cylinder (Tube) Inner Diameter (Ø) | Stroke (mm) | Environment, Applications | Operating Temperature (°C) | Operating Pressure (MPa) | Auto Switches | Lead Wire | The number of the switches | Connector type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
- | 1 Piece(s) | Quote | - | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9N | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9NW | 0.5 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 60 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 80 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 90 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 100 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | - | 100 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper-free and fluorine-free specification | ||
- | 1 Piece(s) | Quote | 6 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.12 to 0.7 | M9B | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 6 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 6 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 10 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9B | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 10 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
SGD 149.33 | 1 Piece(s) | 32 Day(s) | 10 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | A93 | 0.5 | 1 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | A93V | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9BV | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 16 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | - | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9P | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 20 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | A93 | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9BW | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 25 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (relief type) | ||
- | 1 Piece(s) | Quote | 6 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 6 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 6 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.12 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
SGD 143.03 | 1 Piece(s) | 32 Day(s) | 6 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.12 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
SGD 247.57 | 1 Piece(s) | 32 Day(s) | 6 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.12 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 10 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 10 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
SGD 149.33 | 1 Piece(s) | 32 Day(s) | 10 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
SGD 250.48 | 1 Piece(s) | 32 Day(s) | 10 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.06 to 0.7 | M9N | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 5 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 16 | 30 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.06 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 15 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | A93 | 0.5 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 20 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | A93 | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
SGD 152.60 | 1 Piece(s) | 32 Day(s) | 20 | 50 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 25 | 10 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
- | 1 Piece(s) | Quote | 25 | 20 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | - | 0.05 to 0.7 | M9B | 3 | 2 | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) | ||
SGD 161.93 | 1 Piece(s) | 32 Day(s) | 25 | 25 | Non-use of Copper and fluoropolymer-based Material (Partially Plating) / Clean Room | -10～70 | 0.05 to 0.7 | Without auto switch | - | - | - | Copper/fluorine/silicone-free + low dust generation (vacuum type) |
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Basic Information
| Rod Operation Method | Single Rods | Main Body Shape | Plate Cylinder | Cylinder Operation Method | Double Acting |
|---|---|---|---|---|---|
| Additional Function | Standard | End Locking | No | Valves | No |
| Specifications | Built-in magnet |
Specification/Dimensions
-
Cylinder (Tube) Inner Diameter(Ø)
-
Stroke(mm)
-
Environment, Applications
- Non-use of Copper and fluoropolymer-based Material (Partially Plating)
- Clean Room
-
Operating Pressure(MPa)
-
Auto Switches
-
Lead Wire
- 0.5
- 1
- 3
- 5
-
The number of the switches
-
Connector type
- M12-4 pin plug connector
-
Type
- Clean Series (relief type)
- Clean Series (vacuum type)
- Copper-free and fluorine-free specification
- Copper/fluorine/silicone-free + low dust generation (relief type)
- Copper/fluorine/silicone-free + low dust generation (vacuum type)
-
type
- 10-CDU
- 11-CDU
- 20-CDU
- 21-CDU
- 22-CDU
Days to Ship
-
- All
- 32 Day(s) or Less
Specify Alterations
- The specifications and dimensions of some parts may not be fully covered. For exact details, refer to manufacturer catalogs .
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- Credit Card
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- Bank Transfer
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